DocumentCode :
2732512
Title :
Power amplification in UHF band using SiC RF power BJTs
Author :
Agarwal, Anant ; Capell, Craig ; Phan, Binh ; Milligan, James ; Palmour, John W. ; Stambaugh, Jerry ; Bartlow, Howard ; Brewer, Ken
Author_Institution :
Cree Inc, Durham, NC, USA
fYear :
2002
fDate :
6-8 Aug. 2002
Firstpage :
41
Lastpage :
49
Abstract :
4H-SiC RF bipolar junction transistors (BJTs) have been designed and tested at 425 MHz for the first time. Both epitaxial and implanted emitter structures have been fabricated. It has been established that the implanted emitter structure has very low current gain (∼1) due to the implant damage which cannot be totally removed by the high temperature activation anneal. The epitaxial emitter structure with collector and base thickness of 5 μm and 0.1 μm, respectively, shows a maximum current gain of 15 and a common emitter breakdown voltage of 500 V. The fT of this device was about 1.5 GHz. The epitaxial emitter device, with an emitter width of 2.5 μm and an emitter periphery of 2.62 cm, has demonstrated an output power of 50 W/cell using an 80 V power supply in common emitter, class AB mode. The pulse width was 100 μs and duty cycle was 10%. The collector efficiency at a power output of 50 W was 51% with a power gain of 9.3 dB. The peak large signal power gain was 9.6 dB.
Keywords :
UHF bipolar transistors; UHF power amplifiers; power bipolar transistors; semiconductor device breakdown; semiconductor device measurement; silicon compounds; wide band gap semiconductors; 0.1 micron; 1.5 GHz; 100 mus; 2.5 micron; 2.62 cm; 425 MHz; 4H-SiC RF bipolar junction transistors; 5 micron; 50 W; 500 V; 51 percent; 80 V; 9.3 dB; 9.6 dB; SiC; SiC RF power BJT; UHF power amplification; collector efficiency; collector/base thickness; common emitter breakdown voltage; common emitter class AB mode; emitter width/periphery; epitaxial/implanted emitter structure current gain; high temperature activation annealing; implant damage; output power; peak large signal power gain; power supply voltage; pulse width/duty cycle; Annealing; Gain; Implants; Power generation; Power supplies; Radio frequency; Silicon carbide; Space vector pulse width modulation; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Performance Devices, 2002. Proceedings. IEEE Lester Eastman Conference on
Print_ISBN :
0-7803-7478-9
Type :
conf
DOI :
10.1109/LECHPD.2002.1146730
Filename :
1146730
Link To Document :
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