• DocumentCode
    2732533
  • Title

    High-performance power BJTs in 4H-SiC

  • Author

    Huang, Chin-Fang ; Cooper, James A.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2002
  • fDate
    6-8 Aug. 2002
  • Firstpage
    50
  • Lastpage
    57
  • Abstract
    In this paper, we summarize recent progress in 4H-SiC BJTs at Purdue University. For 50 μm collector devices, BVCEO>3,200 V is achieved. Large devices (active area=1.05 mm2) exhibit common emitter current gain β of around 15, and. specific on-resistance RON,SP of 78 mΩ/cm2. Smaller devices (active area=0.0072 mm2) have β of 20 and RON,SP of 28 mΩ/cm2. For 20 μm collector devices, βs greater than 50 and RON,SP around 26 mΩ/cm2 are observed. The blocking voltage is low (500-700 V) for these devices because of aluminum spiking during the base contact anneal. The observed positive temperature coefficient of RON,SP and negative coefficient of β show that 4H-SiC BJTs can be safely operated in parallel connection. We also observe that β decreases as the spacing between base contact implant and emitter finger is reduced. We attribute this to recombination at defect sites in the p+ implanted base contact.
  • Keywords
    power bipolar transistors; semiconductor device breakdown; semiconductor device measurement; silicon compounds; wide band gap semiconductors; 20 micron; 3200 V; 4H-SiC high-performance power BJT; 50 micron; 500 to 700 V; BJT parallel connection; SiC; base contact anneal aluminum spiking; base contact implant/emitter finger spacing; bipolar junction transistors; blocking voltage; common emitter current gain; gain negative coefficient; p+ implanted base contact defect site recombination; specific on-resistance positive temperature coefficient; Aluminum; Annealing; Argon; Contacts; Fingers; Implants; Silicon carbide; Temperature; Thermal conductivity; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Performance Devices, 2002. Proceedings. IEEE Lester Eastman Conference on
  • Print_ISBN
    0-7803-7478-9
  • Type

    conf

  • DOI
    10.1109/LECHPD.2002.1146731
  • Filename
    1146731