DocumentCode :
2732601
Title :
Channel recessed 4H-SiC MESFETs with Ft of 14.5GHz and Fmax of 40GHz
Author :
Cha, Ho-Young ; Thomas, Christopher I. ; Koley, Goutam ; Kim, Hyungtak ; Eastman, Lester F. ; Spencer, Michael G.
Author_Institution :
Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
fYear :
2002
fDate :
6-8 Aug. 2002
Firstpage :
75
Lastpage :
82
Abstract :
Channel recessed 4H-SiC MESFETs have demonstrated excellent small signal characteristics and the effect of Si3N4 passivation on these devices has been studied in this work. A saturated current of 250-270 mA/mm and a maximum transconductance of 40-45 mS/mm were measured for these devices. The 3-terminal breakdown voltage Vds ranges from 120 V to more than 150 V, depending on gate-drain spacing. 2×200 μm devices with 0.45 μm gate length show high Ft of 14.5 GHz and Fmax of 40 GHz. After Si3N4 passivation, the output power and PAE were increased by 40% and 16%, respectively, for CW power measurement. Other measurements, such as, the change in surface potential and the dispersion of the drain current make it clear that the passivation of SiC MESFETs reduces the surface effects and enhances the RF power performance by suppressing the instability in DC characteristics.
Keywords :
circuit stability; microwave power transistors; millimetre wave power transistors; passivation; power MESFET; semiconductor device breakdown; semiconductor device measurement; silicon compounds; wide band gap semiconductors; 0.45 micron; 120 to 150 V; 14.5 GHz; 200 micron; 40 GHz; 4H-SiC channel recessed MESFET; CW power measurement; DC characteristics instability suppression; PAE; RF power performance enhancement; Si3N4; Si3N4 passivation; SiC; drain current dispersion; gate length; gate-drain spacing; maximum transconductance; output power; saturated current; small signal characteristics; surface effect reduction; surface potential change; three-terminal breakdown voltage; Current measurement; Dispersion; Etching; Gate leakage; MESFETs; Passivation; Power measurement; Silicon carbide; Transconductance; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Performance Devices, 2002. Proceedings. IEEE Lester Eastman Conference on
Print_ISBN :
0-7803-7478-9
Type :
conf
DOI :
10.1109/LECHPD.2002.1146734
Filename :
1146734
Link To Document :
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