DocumentCode
2732665
Title
Understanding Mechanism of Film Attach Material Void Formation in Electronic Packages
Author
Labiano, Alpha
Author_Institution
Intel Technol. Philippines Inc.
fYear
2006
fDate
26-30 March 2006
Firstpage
611
Lastpage
612
Abstract
This paper presents an understanding of void formation in film attach materials which results from the interaction with the different process parameters during package assembly through various laboratory and assembly experiments. This study also comprehends the mechanism of delaminating during reliability stress and data gathered from these experiments were useful in the assessment of new materials for new generation packages
Keywords
assembling; delamination; electronics packaging; assembly experiments; delamination; electronic packages; film attach material; laboratory experiments; package assembly; process parameters; reliability stress; void formation; Assembly; Conducting materials; Delamination; Electronics packaging; Laboratories; Materials reliability; Microassembly; Semiconductor films; Substrates; Temperature; delamination; film attach material; void formation;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9498-4
Electronic_ISBN
0-7803-9499-2
Type
conf
DOI
10.1109/RELPHY.2006.251287
Filename
4017228
Link To Document