• DocumentCode
    2732690
  • Title

    Dependence of power and efficiency of AlGaN/GaN HEMTs on the load resistance for class B bias

  • Author

    Kaper, V. ; Tilak, V. ; Green, B. ; Prunty, T. ; Smart, J. ; Eastman, L.F. ; Shealy, J.R.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
  • fYear
    2002
  • fDate
    6-8 Aug. 2002
  • Firstpage
    118
  • Lastpage
    125
  • Abstract
    The material properties of GaN and the AlGaN/GaN heterostructure such as high breakdown field and high sheet charge density, allow AlGaN/GaN HEMTs to be operated at significantly higher drain bias voltages as compared to other III-V compound semiconductor FETs. As expected, larger RF voltage and current swings result in higher normalized output power at microwave frequencies. AlGaN/GaN HEMTs are capable of generating output power density in excess of 10 W/mm in the X-band, which is at least an order of magnitude larger than what is obtainable with GaAs FETs. In this paper, we discuss the effect of the load impedance on measured output power (Pout) and efficiency (η) at various drain bias conditions in class B mode. Dynamic loadlines; extracted at the device´s output are used for analysis of the trade-off between voltage and current swings at different load resistances and its effect on output power and efficiency.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; microwave power transistors; power HEMT; semiconductor device breakdown; semiconductor device measurement; semiconductor device models; wide band gap semiconductors; AlGaN-GaN; AlGaN/GaN HEMT; AlGaN/GaN heterostructure high breakdown field; GaAs FET; HEMT class B bias load resistance power/efficiency dependence; III-V compound semiconductor FET; RF voltage/current swings; X-band output power density; drain bias voltages; dynamic loadlines; load impedance effects; load resistances; microwave frequency normalized output power; sheet charge density; Aluminum gallium nitride; Breakdown voltage; FETs; Gallium nitride; HEMTs; III-V semiconductor materials; MODFETs; Material properties; Power generation; Semiconductor device breakdown;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Performance Devices, 2002. Proceedings. IEEE Lester Eastman Conference on
  • Print_ISBN
    0-7803-7478-9
  • Type

    conf

  • DOI
    10.1109/LECHPD.2002.1146739
  • Filename
    1146739