DocumentCode
2732690
Title
Dependence of power and efficiency of AlGaN/GaN HEMTs on the load resistance for class B bias
Author
Kaper, V. ; Tilak, V. ; Green, B. ; Prunty, T. ; Smart, J. ; Eastman, L.F. ; Shealy, J.R.
Author_Institution
Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
fYear
2002
fDate
6-8 Aug. 2002
Firstpage
118
Lastpage
125
Abstract
The material properties of GaN and the AlGaN/GaN heterostructure such as high breakdown field and high sheet charge density, allow AlGaN/GaN HEMTs to be operated at significantly higher drain bias voltages as compared to other III-V compound semiconductor FETs. As expected, larger RF voltage and current swings result in higher normalized output power at microwave frequencies. AlGaN/GaN HEMTs are capable of generating output power density in excess of 10 W/mm in the X-band, which is at least an order of magnitude larger than what is obtainable with GaAs FETs. In this paper, we discuss the effect of the load impedance on measured output power (Pout) and efficiency (η) at various drain bias conditions in class B mode. Dynamic loadlines; extracted at the device´s output are used for analysis of the trade-off between voltage and current swings at different load resistances and its effect on output power and efficiency.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; microwave power transistors; power HEMT; semiconductor device breakdown; semiconductor device measurement; semiconductor device models; wide band gap semiconductors; AlGaN-GaN; AlGaN/GaN HEMT; AlGaN/GaN heterostructure high breakdown field; GaAs FET; HEMT class B bias load resistance power/efficiency dependence; III-V compound semiconductor FET; RF voltage/current swings; X-band output power density; drain bias voltages; dynamic loadlines; load impedance effects; load resistances; microwave frequency normalized output power; sheet charge density; Aluminum gallium nitride; Breakdown voltage; FETs; Gallium nitride; HEMTs; III-V semiconductor materials; MODFETs; Material properties; Power generation; Semiconductor device breakdown;
fLanguage
English
Publisher
ieee
Conference_Titel
High Performance Devices, 2002. Proceedings. IEEE Lester Eastman Conference on
Print_ISBN
0-7803-7478-9
Type
conf
DOI
10.1109/LECHPD.2002.1146739
Filename
1146739
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