• DocumentCode
    2732720
  • Title

    Simulation of Corrugated Coaxial Cables using the Meshless Radial Point Interpolation Time-Domain Method

  • Author

    Böcklin, Christoph ; Kaufmann, Thomas ; Hoffmann, Johannes ; Fumeaux, Christophe ; Vahldieck, Rüdiger

  • Author_Institution
    Lab. for Electromagn. Fields & Microwave Electron., ETH Zurich, Zurich
  • fYear
    2009
  • fDate
    12-16 Jan. 2009
  • Firstpage
    37
  • Lastpage
    40
  • Abstract
    Meshless numerical simulation methods are gaining attention in different research fields. The ability for conformal and multi-scale modelling as well as the potential for a dynamic node adaptation make them interesting for many applications. The meshless radial point interpolation method (RPIM) in time-domain is proposed here as a versatile simulation technique for electromagnetic problems. In this framework, a conformal boundary treatment is described and validated in a 2D cylindrically symmetric arrangement. These conformal boundaries can be applied for example to simulate the influence of production tolerances or manufacturing properties in corrugated coaxial copper cables. Reflections arising from ripples of a corrugated copper cable are analyzed in particular here and the simulation results exhibit a perfectly linear dependence in a log-log plot between the reflected energy and the extent of the corrugation. The obtained results are validated successfully through comparison with a finite-element solution of the problem. Finally, the phase and amplitude variations of a sinusoidal signal propagating in the corrugated cable are characterized.
  • Keywords
    coaxial cables; finite element analysis; interpolation; time-domain analysis; coaxial copper cables; conformal boundary treatment; corrugated coaxial cables; finite element solution; meshless radial point interpolation; time-domain method; Analytical models; Coaxial cables; Copper; Electromagnetic reflection; Interpolation; Numerical simulation; Potential well; Production; Time domain analysis; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2009 20th International Zurich Symposium on
  • Conference_Location
    Zurich
  • Print_ISBN
    978-3-9523286-4-4
  • Type

    conf

  • DOI
    10.1109/EMCZUR.2009.4783384
  • Filename
    4783384