• DocumentCode
    2732858
  • Title

    Particle Attrition Analysis in a High Temperature Rotating Drum

  • Author

    Vijayarangan, B.R. ; Moujaes, Samir ; Flores, Michael

  • Author_Institution
    Dept. of Mech. Eng., Nevada Univ., Las Vegas, NV
  • fYear
    2008
  • fDate
    19-21 Aug. 2008
  • Firstpage
    512
  • Lastpage
    518
  • Abstract
    Particle attrition is one of the important studies to be investigated as part of solid particle solar receiver design and developmental program. Two types of mechanism encountered in attrition are (a) Abrasion: wearing down by friction. Particles of much smaller size break away from the original particle. (b)Fragmentation: the breaking-away process gives rise to a number of particles of size smaller than the original one. In general, attrition takes place by an abrasive type mechanism. The attrition phenomenon is between the son particles and the fines produced. The mass of fines produced will therefore provide a means of measurement of the degree of attrition. The phenomenon of attrition in a fluidized bed is analyzed and its merits and demerits are discussed with respect to particle attrition in solar receiver, specifically at high temperature close to 1000 degC. The possible fluidized bed demerits are overcome through an appropriate design and development of high temperature (up to 1000 degC) rotating drum, and this is analyzed in this paper.
  • Keywords
    abrasion; fluidised beds; abrasive type mechanism; fluidized bed; high temperature rotating drum; particle attrition analysis; solid particle solar receiver design; Ceramics; Design engineering; Fluidization; Heat transfer; Mechanical engineering; Petroleum; Solar energy; Solids; Systems engineering and theory; Temperature; high temperature; particle attrition; solar particle receiver;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems Engineering, 2008. ICSENG '08. 19th International Conference on
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    978-0-7695-3331-5
  • Type

    conf

  • DOI
    10.1109/ICSEng.2008.72
  • Filename
    4616689