Advanced Surface Laminar Circuit using new composite materials

This paper introduces a newly developed Advanced Surface Laminar Circuit (Adv-SLC) packaging technology, which utilizes new composite materials. Adv-SLC is a buildup substrate technology designed to satisfy the requirements of the most advanced semiconductor chips. We have developed a new dielectric material that is a build-up layer composed of two different materials. We also used a new material for the core substrate composed of Liquid Crystalline Polymer (LCP) reinforced with glass cloth. The new build-up layer has the following reliable properties: it can maintain both conductivity and dielectricity under the conditions of both a line/space width of 10/10μm and a via diameter of 30μm. The new core substrate also has excellent reliable properties as follows: it can maintain both conductivity and dielectricity under the condition of both a through hole diameter of 60μm and a through hole pitch of 120μm. We were able to confirm that the formation of the new substrate with the aforementioned new design rules contributes to reduce the silicon chip size. Consequently, due to all of the aforementioned properties, Adv-SLC contributes to reduce thermal stress when we mount a flip chip.