DocumentCode :
2733045
Title :
Experimental results for 100 μm pitch TAB technology
Author :
Sugimoto, M. ; Yoshida, T. ; Sumi, Y. ; Hasegawa, H. ; Wada, K.
Author_Institution :
Fujitsu Labs. Ltd., Kawasaki, Japan
fYear :
1988
fDate :
13-15 Jun 1988
Firstpage :
53
Lastpage :
56
Abstract :
Fine line, high pin count TAB (tape automated bonding) has been demonstrated using a 13-mm2 test die with 100 μm pitch, and 484 gold bumps. Gold-tin eutectic bonding was carried out on the test die for both ILB (inner lead bonding) and OLB (outer lead bonding)
Keywords :
VLSI; lead bonding; packaging; semiconductor technology; 100 micron; Au-Sn; eutectic bonding; inner lead bonding; outer lead bonding; test die; Annealing; Automatic testing; Bonding; Fabrication; Gold; Pins; Production; Resists; Semiconductor device packaging; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location :
Neuilly sur Seine
Type :
conf
DOI :
10.1109/EEMTS.1988.75953
Filename :
75953
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2733045
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