• DocumentCode
    2733045
  • Title

    Experimental results for 100 μm pitch TAB technology

  • Author

    Sugimoto, M. ; Yoshida, T. ; Sumi, Y. ; Hasegawa, H. ; Wada, K.

  • Author_Institution
    Fujitsu Labs. Ltd., Kawasaki, Japan
  • fYear
    1988
  • fDate
    13-15 Jun 1988
  • Firstpage
    53
  • Lastpage
    56
  • Abstract
    Fine line, high pin count TAB (tape automated bonding) has been demonstrated using a 13-mm2 test die with 100 μm pitch, and 484 gold bumps. Gold-tin eutectic bonding was carried out on the test die for both ILB (inner lead bonding) and OLB (outer lead bonding)
  • Keywords
    VLSI; lead bonding; packaging; semiconductor technology; 100 micron; Au-Sn; eutectic bonding; inner lead bonding; outer lead bonding; test die; Annealing; Automatic testing; Bonding; Fabrication; Gold; Pins; Production; Resists; Semiconductor device packaging; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
  • Conference_Location
    Neuilly sur Seine
  • Type

    conf

  • DOI
    10.1109/EEMTS.1988.75953
  • Filename
    75953
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2733045