• DocumentCode
    2733162
  • Title

    Comparative thermal analysis of solar cells mounted on ceramic and metallic carriers and their optimization for CPV applications

  • Author

    Arenas, Osvaldo ; Collin, Louis M. ; Chow, Simon ; Wheeldon, Jeffrey F. ; Valdivia, Christopher E. ; Hinzer, Karin ; Frechette, Luc ; Aimez, Vincent ; Arès, Richard

  • Author_Institution
    Centre de Rech. en Nanofabrication et en Nanocaracterisation CRN2, Univ. de Sherbrooke, Sherbrooke, QC, Canada
  • fYear
    2010
  • fDate
    20-25 June 2010
  • Abstract
    Concentrated photovoltaic (CPV) systems dramatically reduce the size of the solar cell. However, they add thermal load to the solar cell which reduces its efficiency. This reduction is due to an increase in temperature, which is largely dependent on the thermal characteristics of the solar cell carrier. From 1 to 2000X solar concentration, we conducted thermal finite element simulations to determine the temperature of a 1 cm2 solar cell. The thermal behavior of a solar cell mounted upon a ceramic carrier and a metallic carrier are compared. The metallic carrier demonstrates better thermal performance than the ceramic carrier, in which the temperature of the cell is found to be ΔT= -60.2K at 500X and ΔT = -120.4K at 1000X with respect to the ceramic carrier. It was determined that the optimum size of the copper plate of a metallic carrier was 25.1 mm of side length and 1.12 mm of thickness for a cell temperature of 320.9K at a concentration factor of 500X.
  • Keywords
    ceramics; finite element analysis; solar cells; solar energy concentrators; thermal analysis; CPV applications; ceramic carriers; comparative thermal analysis; concentrated photovoltaic systems; copper plate; metallic carriers; solar cell carriers; solar concentration; thermal finite element simulations; Ceramics; Cooling; Copper; Photovoltaic cells; Solid modeling; Sun; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
  • Conference_Location
    Honolulu, HI
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-5890-5
  • Type

    conf

  • DOI
    10.1109/PVSC.2010.5614131
  • Filename
    5614131