DocumentCode :
2733169
Title :
Intermodulation distortion as indicator for interconnect degradation
Author :
Krüger, Michael ; Nils, F Nissen ; Reichl, Herbert
Author_Institution :
Tech. Univ. Berlin, Berlin, Germany
fYear :
2010
fDate :
1-4 June 2010
Firstpage :
477
Lastpage :
483
Abstract :
The scope of this paper lies in the justification and combination of observed non-linearities in passive components with their remaining lifetime. We investigate the applicability of non-linearity measurement techniques for detecting interconnect degradations in their early state. In the first part of the paper we describe the generation of intermodulation signals and show ways to use these signals as indicator for upcoming failures. This technique could overcome the drawbacks in sensitivity of more traditional measurement techniques like resistance measurements. In the second part, two kinds of specimen are used to investigate their non-linear behavior during degradation. Failure analysis is done to inspect the degradation states of the specimens and compare it to measurement. At the end we show experimentally a link between non-linearity and degradation and give an outlook to future improvements.
Keywords :
Assembly; Condition monitoring; Degradation; Electrical resistance measurement; Frequency; Integrated circuit interconnections; Intermodulation distortion; Measurement techniques; Signal generators; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV, USA
ISSN :
0569-5503
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2010.5490927
Filename :
5490927
Link To Document :
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