• DocumentCode
    2733214
  • Title

    Silicon-germanium power devices at low temperatures for deep-space applications

  • Author

    Vijh, A. ; Kapoor, V.J.

  • Author_Institution
    Nanotechnology Res. Center, Toledo Univ., OH, USA
  • fYear
    2002
  • fDate
    6-8 Aug. 2002
  • Firstpage
    270
  • Lastpage
    275
  • Abstract
    Silicon-germanium heterostructure. based 1-watt n-channel metal-oxide-semiconductor modulation-doped field effect transistors (MOS-MODFETs) with 6 μm gate lengths and 1 mm total gate widths have been designed, fabricated and tested from 300 K to 90 K. The devices were fabricated by an ion-implanted process and employ a low-temperature thermal oxide and PECVD deposited oxide as the gate insulator. The devices showed a saturation current of approximately 77 mA at VDS=14 V, VGS=5V at 90 K, corresponding to a power dissipation of 1 W. Because they employ oxide as a gate dielectric, the devices have a low gate leakage current of <1 nA at VGS=10 V.
  • Keywords
    Ge-Si alloys; cryogenic electronics; ion implantation; power HEMT; power MOSFET; semiconductor materials; space vehicle electronics; 1 W; 1 mm; 14 V; 5 V; 6 micron; 77 mA; 90 to 300 K; I-V characteristics; PECVD deposited oxide; PECVD gate insulator; SiGe; SiGe MOS-MODFETs; SiGe heterostructure power devices; deep-space applications; gate leakage current; ion-implanted process; low temperatures; low-temperature thermal oxide; modulation-doped field effect transistors; n-channel MOS-MODFETs; Dielectric devices; Dielectrics and electrical insulation; Germanium silicon alloys; HEMTs; Insulator testing; MODFETs; Metal-insulator structures; Power dissipation; Silicon germanium; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Performance Devices, 2002. Proceedings. IEEE Lester Eastman Conference on
  • Print_ISBN
    0-7803-7478-9
  • Type

    conf

  • DOI
    10.1109/LECHPD.2002.1146763
  • Filename
    1146763