Title :
Size Effects and Temperature Dependence of Stress-Induced Voiding
Author :
Hommel, Martina ; Penka, Sabine
Author_Institution :
Infineon Technol. AG, Muenchen
Abstract :
In this investigation the stress-induced voiding (SIV) behavior of via structures with different geometries was tested. A variation of via sizes, aspect ratios, and widths of connected metal lines was studied. The resistance drift and its temperature dependence behavior showed sensitivity to the structure size. This can be explained by the size-dependence of mechanical stress in the metallization
Keywords :
integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; metals; stress effects; interconnect; mechanical stress; metal lines; metallization; resistance drift; size effects; stress-induced voiding behavior; temperature dependence; via structures; Temperature dependence; interconnect; mechanical stress; size effect; stress-induced voiding;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
DOI :
10.1109/RELPHY.2006.251324
