Title :
Vertical Electromagnetic Bandgap Structure for Noise Suppression in Single-ended and Differential Signaling on a Multi-layer Backplane Board
Author :
Hwang, Chulsoon ; Park, Jongbae ; Kim, Jaemin ; Koo, Kyoungchoul ; Kim, Joungho
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon
Abstract :
Signal via transition is inevitable in backplane multi-layer board for high density routing. And a significant simultaneous switching noise (SSN) coupling to a signal occurs through the signal via transition. In this paper, we present suppression method of the SSN noise coupling caused by via transition in multi-layer backplane board using electromagnetic bandgap (EBG) structure. EBG structures are vertically located around a signal via to provide the low power/ground impedance area. The low power/ground impedance area suppresses the noise propagation and reduces the SSN noise coupling. It is shown that, within the stopband, the power/ground impedance at the position of the signal via with EBG structures is free from the power/ground planes cavity resonance, and the SSN coupling in single-ended and differential signaling is suppressed.
Keywords :
error statistics; interference suppression; network routing; photonic band gap; printed circuits; bit error rate; differential signalling; high density routing; high-speed digital system PCB; low power-ground impedance area; multilayer backplane board; noise propagation; noise suppression; signal via transition; simultaneous switching noise coupling; single-ended signaling; vertical electromagnetic bandgap structure; Backplanes; Electromagnetic coupling; Electromagnetic interference; Electromagnetic propagation; Impedance; Metamaterials; Noise reduction; Periodic structures; Resonance; Routing;
Conference_Titel :
Electromagnetic Compatibility, 2009 20th International Zurich Symposium on
Conference_Location :
Zurich
Print_ISBN :
978-3-9523286-4-4
DOI :
10.1109/EMCZUR.2009.4783424
