Surface mount solder joint reliability controlling the thermal expansion

The reliability of the solder joints of surface-mounted assemblies is a continuing concern. This concern stems from the very complex and little understood nature of the interacting mechanisms underlying thermally induced solder joint fatigue combined with the highly varying nature of accelerated reliability testing and the frequently contradictory results. The nature of the problem is discussed. The different types of surface-mount attachments are highlighted in the context of accelerated reliability test results. Accelerated reliability test concerns are discussed and testing options given. Options for increased solder-joint reliability are also suggested