Surface mount solder joint reliability controlling the thermal expansion

Author

Engelmaier, Werner

Author_Institution

AT&T Bell Labs., Whippany, NJ, USA

fYear

1988

fDate

13-15 Jun 1988

Firstpage

62

Lastpage

65

Abstract

The reliability of the solder joints of surface-mounted assemblies is a continuing concern. This concern stems from the very complex and little understood nature of the interacting mechanisms underlying thermally induced solder joint fatigue combined with the highly varying nature of accelerated reliability testing and the frequently contradictory results. The nature of the problem is discussed. The different types of surface-mount attachments are highlighted in the context of accelerated reliability test results. Accelerated reliability test concerns are discussed and testing options given. Options for increased solder-joint reliability are also suggested

Keywords

electronic equipment testing; life testing; reliability; soldering; surface mount technology; thermal expansion; accelerated reliability test; solder joints; surface-mounted assemblies; thermal expansion; Acceleration; Capacitive sensors; Fatigue; Lead; Life estimation; Power system reliability; Soldering; Temperature; Testing; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International

Conference_Location

Neuilly sur Seine

Type

conf

DOI

10.1109/EEMTS.1988.75955

Filename

75955