DocumentCode
2733409
Title
Atomistic simulations of heat transfer at carbon nanotube/Si interfaces
Author
Cao, Ajing ; Qu, Jianmin ; Yao, Matthew
Author_Institution
Civil & Environ. Eng., Northwestern Univ., Evanston, IL, USA
fYear
2010
fDate
1-4 June 2010
Firstpage
417
Lastpage
420
Abstract
Molecular dynamics simulations are used to compute the thermal conductance at the interface between an open-end single-wall carbon nanotube and a Si substrate for different CNT lengths and temperature. It is found that the thermal conductance at the CNT/Si interface increases with increasing temperature up to 1200K. The enhanced phonon transfer at higher temperatures is mainly due to the anharmonicity at the interfaces. Strong thermal and mechanical coupling is also observed, i.e., the thermal conductance at the CNT/Si interface is dependent on the contact pressure at the interface.
Keywords
carbon nanotubes; heat transfer; molecular dynamics method; thermal conductivity; C-Si; Si; Si substrate; atomistic simulations; carbon nanotube-Si interfaces; enhanced phonon transfer; heat transfer; mechanical coupling; molecular dynamics simulations; thermal conductance; thermal coupling; Carbon nanotubes; Conducting materials; Heat transfer; Phase change materials; Phonons; Slabs; Temperature; Thermal conductivity; Thermal management; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location
Las Vegas, NV
ISSN
0569-5503
Print_ISBN
978-1-4244-6410-4
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2010.5490940
Filename
5490940
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