• DocumentCode
    2733409
  • Title

    Atomistic simulations of heat transfer at carbon nanotube/Si interfaces

  • Author

    Cao, Ajing ; Qu, Jianmin ; Yao, Matthew

  • Author_Institution
    Civil & Environ. Eng., Northwestern Univ., Evanston, IL, USA
  • fYear
    2010
  • fDate
    1-4 June 2010
  • Firstpage
    417
  • Lastpage
    420
  • Abstract
    Molecular dynamics simulations are used to compute the thermal conductance at the interface between an open-end single-wall carbon nanotube and a Si substrate for different CNT lengths and temperature. It is found that the thermal conductance at the CNT/Si interface increases with increasing temperature up to 1200K. The enhanced phonon transfer at higher temperatures is mainly due to the anharmonicity at the interfaces. Strong thermal and mechanical coupling is also observed, i.e., the thermal conductance at the CNT/Si interface is dependent on the contact pressure at the interface.
  • Keywords
    carbon nanotubes; heat transfer; molecular dynamics method; thermal conductivity; C-Si; Si; Si substrate; atomistic simulations; carbon nanotube-Si interfaces; enhanced phonon transfer; heat transfer; mechanical coupling; molecular dynamics simulations; thermal conductance; thermal coupling; Carbon nanotubes; Conducting materials; Heat transfer; Phase change materials; Phonons; Slabs; Temperature; Thermal conductivity; Thermal management; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-6410-4
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2010.5490940
  • Filename
    5490940