DocumentCode :
2733477
Title :
Enhanced GOI Degradation and Reliability Improvement of Nitrogen and Indium Co-Implant for Advanced Dual-Gate Oxide Application
Author :
Wang, J.S. ; Wu, Nan-Cyi ; Lu, Hui ; Wang, Tings ; Hsieh, Joe ; Hsu, H.K. ; Chen, Dino ; Fong, Thomas ; Mei, Len
Author_Institution :
ProMOS Technol. Inc., Hsin-Chu
fYear :
2006
fDate :
26-30 March 2006
Firstpage :
709
Lastpage :
710
Abstract :
Indium and nitrogen implant were used to form the NMOSFET retrograde channel and low-threshold thin-oxide devices respectively. These two impurities are implanted into the same MOSFET channel before gate oxidation for an advanced low cost DRAM technology. High dose of indium implant degrades the oxide integrity, and with the acceding of the nitrogen impurities, enhanced GOI (gate oxide integrity) degradation were observed such as inducing abnormal Fowler-Nordheim (F-N) leakages, increasing ratio of near zero BVd defects. These phenomena were verified in both our 200mm and 300mm baseline. Fluorine impurities can be used to heal the implant-induced damage and improve the reliability of the gate oxides
Keywords :
DRAM chips; MOSFET; fluorine; impurities; indium; ion implantation; nitrogen; oxidation; semiconductor device reliability; 200 mm; 300 mm; BVd defects; DRAM; F; Fowler-Nordheim leakages; In; N; NMOSFET retrograde channel; fluorine impurities; gate oxidation; gate oxide integrity degradation; indium impurities; low-threshold thin-oxide devices; nitrogen impurities; reliability improvement; Costs; Degradation; Design for quality; Electric breakdown; Implants; Impurities; Indium; MOSFET circuits; Nitrogen; Random access memory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9498-4
Electronic_ISBN :
0-7803-9499-2
Type :
conf
DOI :
10.1109/RELPHY.2006.251336
Filename :
4017277
Link To Document :
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