• DocumentCode
    2733480
  • Title

    Utilizing time-domain waveform to synthesize scalable SPICE-compatible macro-models of interconnectors

  • Author

    Wang, Chen-Chao ; Kuo, Chih-Wen ; Wu, Che-Ching ; Wu, Sung-Mao ; Chiu, C.T. ; Hung, C.P.

  • Author_Institution
    Electr. Lab., Adv. Semicond. Eng. (ASE) Inc., Kaohsiung, Taiwan
  • fYear
    2010
  • fDate
    1-4 June 2010
  • Firstpage
    389
  • Lastpage
    395
  • Abstract
    A novel time-domain approach is proposed to synthesize the scalable macro-model of the interconnectors based on time-domain reflected waveforms either measured by TDR or simulated by FDTD method. The step responses of the interconnectors are solved in terms of rational functions by the generalized Pencil-of-Matrix (GPOM) method. The macro- model in terms of the rational functions pairs is obtained through microwave matrix transformation. The equivalent lumped circuits of the macro-model are synthesized by a lumped circuit extraction method (LCEM). The regression analysis is utilized to construct scalable regression equations from equivalent lumped circuits of the macro-model. The stability of the extracted models can be preserved based on this time-domain approach and the macro-model topology. Two examples, one is an un-uniform transmission line in two-layer FR4 board and the other is a through via in four-layer FR4 PCB, are used to demonstrate the accuracy of the scalable equivalent lumped circuits of the macro-model.
  • Keywords
    Circuit simulation; Circuit stability; Circuit synthesis; Circuit topology; Equations; Finite difference methods; Integrated circuit interconnections; Regression analysis; Time domain analysis; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-6410-4
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2010.5490944
  • Filename
    5490944