A combined transfer function and neural network method for modeling via in multilayer circuits

A new approach for via modeling in multilayer circuits is presented in this paper. The proposed technique combines transfer function with neural network to enhance the learning ability of neural network. It is capable of providing accurate simulation models even if an equivalent circuit is not available. It retains the EM level accuracy and reduces CPU time significantly compared to EM simulator. Examples of via holes for both multilayer printed circuit boards and integrated circuits are presented to demonstrate the accuracy and efficiency of this proposed method.