DocumentCode
2733531
Title
Study on the Retention Time of Body Tied FINFET DRAM with <100> Channel Directional Wafer
Author
Lee, Chul ; Kim, Keunnam ; Cho, Eun Suk ; Ko, Sanggi ; Kim, Chang Kyu ; Park, Hyun Ho ; Kim, Dongchan ; Lee, Choong-Ho ; Park, Donggun
Author_Institution
Device Res. Team, Samsung Electron., Kyoungi-Do
fYear
2006
fDate
26-30 March 2006
Firstpage
717
Lastpage
718
Abstract
A negative word line (NWL) bias scheme is adapted to the body tied finFET DRAM. But, increased gate induced drain leakage (GIDL) degrade data retention time. The retention time of lang100rang channel directional wafer (CW) was compared to that of lang110rang CW. Using lang100rang CW to the finFET DRAM, the reduced GIDL current improve the data retention time
Keywords
DRAM chips; MOSFET; leakage currents; DRAM; FINFET; channel directional wafer; data retention time; gate induced drain leakage current; negative word line bias scheme; Degradation; Doping; Electron mobility; Fabrication; FinFETs; Leakage current; Probability distribution; Random access memory; Research and development; Threshold voltage; GIDL; finFET; retention time; wafer orientation;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9498-4
Electronic_ISBN
0-7803-9499-2
Type
conf
DOI
10.1109/RELPHY.2006.251340
Filename
4017281
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