DocumentCode
2733551
Title
Investigation into the Dependency of Plasma Induced Damage on the Structural MOS Geometry with a Fast WLR Stress and Measurement Sequence
Author
Martin, Andreas ; Schlunder, Christian ; Oswald, Peter-Eberhard
Author_Institution
Central Reliability Methodologies, Infineon Technol. AG, Muenchen
fYear
2006
fDate
26-30 March 2006
Firstpage
719
Lastpage
720
Abstract
Here in this work this new type of fast WLR (fWLR) stress sequence is used together with a large set of test structures. This fast stress does not result in lifetimes but pinpoints extrinsic characteristics and the differences between lots and wafers and is highly suitable for in-line measurements. For the optimization of the structural PID sensitivity, the transistor geometries were varied. It is shown that structural PID sensitivity depends not only on the size of the antenna area but also on the size of the active MOS area and the W/L ratio of the MOS transistor
Keywords
MOSFET; antennas; semiconductor device testing; MOS transistor; W/L ratio; active MOS area; antenna area; fast WLR stress sequence; in-line measurements; measurement sequence; optimization; plasma induced damage; structural MOS geometry; structural PID sensitivity; test structures; transistor geometries; Antenna measurements; Current measurement; Geometry; Integrated circuit technology; MOS devices; MOSFETs; Plasma measurements; Stress measurement; Testing; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9498-4
Electronic_ISBN
0-7803-9499-2
Type
conf
DOI
10.1109/RELPHY.2006.251341
Filename
4017282
Link To Document