Title :
Surface mounting: experiences in the telecommunication field
Author :
Castelli, G. ; Costa, P.
Author_Institution :
Telettra SpA, Vimercate, Italy
Abstract :
The authors´ experience with surface-mounting technology (SMT) is discussed. Vapor phase reflow and wave soldering are considered as well as design rules, printed circuit boards, solder creams, and assembly. Emphasis is given to the correlation between process parameters and yields and it is shown how many standards that are peculiar to through hole mounting result in unacceptable yields for SMT assembly processes
Keywords :
soldering; surface mount technology; telecommunication equipment; SMT; assembly; correlation; design rules; printed circuit boards; process parameters; solder creams; standards; surface-mounting technology; telecommunication; through hole mounting; vapour phase reflow; wave soldering; yields; Assembly systems; Circuit testing; Lead; Manufacturing automation; Manufacturing industries; Manufacturing processes; Printed circuits; Soldering; Surface waves; Surface-mount technology;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location :
Neuilly sur Seine
DOI :
10.1109/EEMTS.1988.75956
