Title :
Interactions between Vias and the PCB Power-Bus
Author :
Heinrich, Gerd ; Dickmann, Stefan
Author_Institution :
Univ. der Bundeswehr Hamburg, Hamburg
Abstract :
In this paper, a method for the investigation of the interactions between a via and a PCB power-bus is described. Starting with an initial via model and two types of de-embedding algorithm, which extract the scattering parameters of the via, the elements of the via model are derived. After that the influence of the via on the power-bus impedance and the interactions between the via and the power-bus are described.
Keywords :
S-parameters; lumped parameter networks; printed circuits; PCB power-bus; PCB vias; S-parameters; de-embedding algorithm; lumped via model; multilayer printed circuit boards; power-bus impedance; scattering parameters; through-hole via; Coupling circuits; Geometry; Impedance; Matrix converters; Nonhomogeneous media; Printed circuits; Scattering parameters; Solid modeling; Transmission line matrix methods; Voltage;
Conference_Titel :
Electromagnetic Compatibility, 2009 20th International Zurich Symposium on
Conference_Location :
Zurich
Print_ISBN :
978-3-9523286-4-4
DOI :
10.1109/EMCZUR.2009.4783439
