DocumentCode
2733600
Title
Interactions between Vias and the PCB Power-Bus
Author
Heinrich, Gerd ; Dickmann, Stefan
Author_Institution
Univ. der Bundeswehr Hamburg, Hamburg
fYear
2009
fDate
12-16 Jan. 2009
Firstpage
257
Lastpage
260
Abstract
In this paper, a method for the investigation of the interactions between a via and a PCB power-bus is described. Starting with an initial via model and two types of de-embedding algorithm, which extract the scattering parameters of the via, the elements of the via model are derived. After that the influence of the via on the power-bus impedance and the interactions between the via and the power-bus are described.
Keywords
S-parameters; lumped parameter networks; printed circuits; PCB power-bus; PCB vias; S-parameters; de-embedding algorithm; lumped via model; multilayer printed circuit boards; power-bus impedance; scattering parameters; through-hole via; Coupling circuits; Geometry; Impedance; Matrix converters; Nonhomogeneous media; Printed circuits; Scattering parameters; Solid modeling; Transmission line matrix methods; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2009 20th International Zurich Symposium on
Conference_Location
Zurich
Print_ISBN
978-3-9523286-4-4
Type
conf
DOI
10.1109/EMCZUR.2009.4783439
Filename
4783439
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