Title :
Chip-Package Co-modeling & Verification of Noise Coupling & Generation in CMOS DC/DC Buck Converter
Author :
Song, Taigon ; Kim, Jiseong ; Pak, Junso ; Kim, Joungho
Author_Institution :
Dept. of EECS, Korea Adv. Inst. of Sci. & Technol., Daejeon
Abstract :
DC/DC Converters are now an essential part in a system due to the various needs of supply voltage that is necessary for different circuits in the system. However, there are many papers which have dealt for efficiency or for a novel structure that would be customized to the specific design, but few dealt with the noise characteristics of DC/DC converters which could critically affect to the output supply voltage the target circuit would need. In this paper we analyzed the effect of noise to a DC/DC Converter in a chip-package co-design. We figured out that the decoupling capacitors on the PCB board cannot shield all the noise that could affect to the DC/DC converter, and on-chip decoupling capacitor for a DC/DC Converter would be necessary.
Keywords :
CMOS integrated circuits; DC-DC power convertors; integrated circuit design; integrated circuit packaging; CMOS DC-DC buck converter; PCB board; chip-package comodeling; noise coupling verification; on-chip decoupling capacitors; Buck converters; CMOS technology; Capacitors; Circuit noise; DC generators; DC-DC power converters; Noise generators; Packaging; Switches; Voltage;
Conference_Titel :
Electromagnetic Compatibility, 2009 20th International Zurich Symposium on
Conference_Location :
Zurich
Print_ISBN :
978-3-9523286-4-4
DOI :
10.1109/EMCZUR.2009.4783446
