DocumentCode :
2733793
Title :
On-board fabrication of multi-channel polymer optical waveguide with graded-index cores by soft-lithography
Author :
Ishigure, Takaaki ; Nitta, Yosuke
Author_Institution :
Fac. of Sci. & Technol., Keio Univ., Yokohama, Japan
fYear :
2010
fDate :
1-4 June 2010
Firstpage :
275
Lastpage :
281
Abstract :
We succeeded in utilizing the soft-lithography method for fabricating a polymer waveguide with GI cores directly on a substrate. A UV-curable polymer (TPIR-202) supplied from Tokyo Ohka Kogyo Co. Ltd. is used to form the matrix of polymer waveguide. The GI cores are formed during the curing process of the core region, which is similar to the preform process we have reported. We experimentally confirm that near parabolic refractive index profiles were formed in the parallel cores (8 to 16 channels) with 80 um × 80 um size at 250-μm pitch. Although the loss is still as high as 0.2 ~ 0.3 dB/cm at 850 nm, which is mainly due to scattering loss inherent to the polymer matrix, the scattering loss attributed to the waveguide´s structural irregularity could be sufficiently reduced by a graded refractive index profile. For comparison, we fabricate SI-core waveguides with the same materials by means of the same process. Then, we evaluate the inter-channel crosstalk in SI- and GI-core waveguides under almost the same conditions. It is noteworthy that remarkable crosstalk reduction (5 dB and beyond) is confirmed in the GI-core waveguides, since the propagating modes in GI-cores are tightly confined near the core center and less optical power is found near the core cladding boundary. This significant improvement in the inter-channel crosstalk allows the GI-core waveguides to be utilized for extra high-density on-board optical interconnections.
Keywords :
Optical crosstalk; Optical device fabrication; Optical interconnections; Optical polymers; Optical refraction; Optical scattering; Optical variables control; Optical waveguides; Refractive index; Transmission line matrix methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV, USA
ISSN :
0569-5503
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2010.5490962
Filename :
5490962
Link To Document :
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