Title :
High density interconnection for VLSI devices
Author :
Ashe, J. ; Tyler, Stephen G.
Author_Institution :
Marconi Res. Centre, Chelmsford, UK
Abstract :
A brief review is given of current packaging technologies, including media and package formats. Esprit 958, a large-area multichip module, is described and its development outlined. Esprit 958´s fabrication is detailed, a transmission-line analysis is presented, and electrical modeling and testing results are given. Also, thermal and environmental considerations are discussed
Keywords :
VLSI; integrated circuit technology; packaging; Esprit 958; VLSI devices; electrical modeling; environmental; high density interconnections; large-area multichip module; packaging; thermal; transmission-line analysis; Ceramics; Electronic packaging thermal management; Electronics packaging; Frequency; Integrated circuit interconnections; Multichip modules; Polymers; Printed circuits; Thermal management; Very large scale integration;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location :
Neuilly sur Seine
DOI :
10.1109/EEMTS.1988.75960
