DocumentCode
2734352
Title
University-industry relationships: ethical challenges
Author
Saha, Subrata ; Saha, Pamela
Author_Institution
R.W. Christensen Biomater. Labs., Alfred Univ., NY, USA
Volume
4
fYear
2003
fDate
17-21 Sept. 2003
Firstpage
3464
Abstract
Biomedical engineering is a rapidly expanding field and it has been largely responsible for the improvements in the treatments of our patients. Many of the medical devices that are being marketed today were developed at universities and medical centers and this research is often supported by biomedical industry. University-industry partnerships are encouraged by federal and state funding agencies. However such relationships also raises the questions related to the conflicts of interests, appropriate protection of patients in clinical trials, full disclosures and monitoring of adverse effects of the use of drugs and devices, and many other ethical issues. University-industry cooperation is essential for invention of new biomedical devices and their rapid introduction to the market place. At the same time we need enforceable guidelines to avoid the pitfalls which may undermine the public´s confidence in the integrity of our biomedical research structure. Examples of such ethical concerns will be discussed with examples of case studies.
Keywords
biomedical engineering; biomedical equipment; drugs; educational institutions; health care; patient treatment; adverse effect monitoring; biomedical devices; biomedical engineering; biomedical industry; biomedical research structure; drugs; ethical challenge; federal funding agencies; full disclosures; medical devices; patient treatment; public confidence; state funding agencies; university-industry relationship; Biomedical engineering; Biomedical monitoring; Clinical trials; Drugs; Educational institutions; Guidelines; Industrial relations; Medical treatment; Patient monitoring; Protection;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2003. Proceedings of the 25th Annual International Conference of the IEEE
ISSN
1094-687X
Print_ISBN
0-7803-7789-3
Type
conf
DOI
10.1109/IEMBS.2003.1280893
Filename
1280893
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