DocumentCode
2734446
Title
Reducing the Electromagnetic Emissions of Smart Power System-on-Chips by Design
Author
Fiori, Franco
Author_Institution
Eln. Dept., Politec. di Torino, Turin
fYear
2009
fDate
12-16 Jan. 2009
Firstpage
445
Lastpage
448
Abstract
The paper deals with the electromagnetic emissions of smart power system on chips (SoCs). The architecture of common integrated smart-power systems is described, hence the propagation of core blocks switching noise through the silicon substrate is discussed referring to simple equivalent circuits. Based on that, a new grounding scheme to reduce substrate voltage bounce is presented in detail and its effectiveness to mitigate electromagnetic emission is shown by means of time domain computer simulations.
Keywords
electromagnetic compatibility; equivalent circuits; power integrated circuits; system-on-chip; time-domain analysis; SoC; core blocks switching noise; electromagnetic emissions; equivalent circuits; smart power system-on-chips; substrate voltage bounce; time domain computer simulations; CMOS technology; Coupling circuits; Grounding; Isolation technology; Power systems; Power transistors; Semiconductor device noise; Silicon; Substrates; Switching circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2009 20th International Zurich Symposium on
Conference_Location
Zurich
Print_ISBN
978-3-9523286-4-4
Type
conf
DOI
10.1109/EMCZUR.2009.4783486
Filename
4783486
Link To Document