Drop Impact Reliability - A Comprehensive Summary

Author

Wong, E.H. ; Mai, Y.-W. ; Seah, S.K.W. ; Rajoo, R. ; Lim, T.B. ; Lim, C.T. ; Field, J.

fYear

2005

fDate

27-29 June 2005

Firstpage

1

Lastpage

11

Abstract

This paper provides a comprehensive summary of research activities focusing on the reliability of board level interconnections in drop impact, covering experimental work together with analytical and numerical modeling studies. These activities involve investigating (i) the dynamics of the PCB in product level and board level drop impact; (ii) the failure drivers: inertia force, differential flexing, and knocking; (iii) the relations among the PCB flexural modes, PCB strain, and interconnection stress/strain; (iv) high-strain-rate material characteristics; and (v) failure models

Keywords

failure analysis; impact testing; interconnections; printed circuit testing; PCB flexural modes; PCB strain; board level interconnections; drop impact reliability; failure models; high-strain-rate material characteristics; interconnection strain; interconnection stress; numerical modeling; Acceleration; Accelerometers; Analytical models; Capacitive sensors; Force measurement; Integrated circuit interconnections; Mobile handsets; Printed circuits; Strain measurement; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on

Conference_Location

Shanghai

Print_ISBN

0-7803-9292-2

Electronic_ISBN

0-7803-9293-0

Type

conf

DOI

10.1109/HDP.2005.251399

Filename

4017440