Moisture assist delamination in multiple die stacked package

The delamination of five-die stacked package with high humidity and high temperature processes was studied by experiments and finite element analysis in the paper. The package were tested by 85degC/85H/196hr condition and followed by solder reflow process. The testing results showed that the delamination was prevalent in samples. Combing the failure analysis of the stack-die package, the finite element analysis was carried out to explain the moisture assist delamination in stacked-die package. The steam pressure in defect void was accounted for in the computations and the energy release rate involving thermal and moisture concentration was discussed as well