Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)

Author

Beh, Keh Shin ; Loh, Wei Keat ; Leong, Jenn Seong ; Tan, Wooi Aun

Author_Institution

Intel Technol. (M) Sdn. Bhd., Penang

fYear

2005

fDate

27-29 June 2005

Firstpage

1

Lastpage

5

Abstract

This paper reviews sub 1.00mm ball pitch solder joint reliability (SJR) challenges under compressive loaded thermal cycling stressing. It focuses on different types of heat sinks and their compressive load effect on solder joint thermal fatigue performance. Heat sink configuration and compressive load applied was found to be important factors in determining failure region across ball grid array (BGA). Lastly, board thickness effect under different heat sink configuration was also evaluated

Keywords

ball grid arrays; flip-chip devices; heat sinks; reliability; solders; thermal stresses; 1 mm; FCBGA; board thickness effect; compressive load effect; flip chip ball grid array; heat sinks; solder joint reliability; thermal cycling stressing; thermal fatigue performance; Electronic packaging thermal management; Electronics packaging; Fatigue; Fixtures; Flip chip; Heat sinks; Soldering; Testing; Thermal loading; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on

Conference_Location

Shanghai

Print_ISBN

0-7803-9292-2

Electronic_ISBN

0-7803-9293-0

Type

conf

DOI

10.1109/HDP.2005.251405

Filename

4017446