Title :
Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)
Author :
Beh, Keh Shin ; Loh, Wei Keat ; Leong, Jenn Seong ; Tan, Wooi Aun
Author_Institution :
Intel Technol. (M) Sdn. Bhd., Penang
Abstract :
This paper reviews sub 1.00mm ball pitch solder joint reliability (SJR) challenges under compressive loaded thermal cycling stressing. It focuses on different types of heat sinks and their compressive load effect on solder joint thermal fatigue performance. Heat sink configuration and compressive load applied was found to be important factors in determining failure region across ball grid array (BGA). Lastly, board thickness effect under different heat sink configuration was also evaluated
Keywords :
ball grid arrays; flip-chip devices; heat sinks; reliability; solders; thermal stresses; 1 mm; FCBGA; board thickness effect; compressive load effect; flip chip ball grid array; heat sinks; solder joint reliability; thermal cycling stressing; thermal fatigue performance; Electronic packaging thermal management; Electronics packaging; Fatigue; Fixtures; Flip chip; Heat sinks; Soldering; Testing; Thermal loading; Thermal stresses;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
DOI :
10.1109/HDP.2005.251405
