DocumentCode
2734766
Title
Newly Developed LCP Film Fabricated by Solvent-Casting Method
Author
Okamoto, Satoshi
Author_Institution
Sumitomo Chem. Co., LTd.
fYear
2005
fDate
27-29 June 2005
Firstpage
1
Lastpage
29
Abstract
The applications of liquid-crystalline polymers that are attracting the most attention in electrical and electronic material fields are the applications in electronic circuit boards. The merits for these electronic circuit board applications are the superior electrical insulating properties and dielectric characteristics that liquid-crystalline polymer films have. In terms of electrical insulating properties, the maintaining of the electrical insulating properties in a high moisture absorbing environment and the obtaining of stability in dielectric characteristics even in high-temperature, high humidity environments are attracting attention. It is predicted that there is a strong demand in the future for liquid-crystalline polymer films, with electronic circuit boards related to information and communications, starting with computers and portable equipment and electronic circuit boards related to automobiles, starting with ITS. Because of these implications, Sumitomo Chemical is moving forward with the development of electronic circuit board applications using films obtained with a solvent -casting method for a liquid-crystalline polymer we have newly developed. In this paper, the author gives an introduction to the status of this development
Keywords
automotive electronics; casting; liquid crystal polymers; printed circuits; automobile electronics; computers equipment; dielectric characteristics; electrical materials; electronic circuit boards; electronic material; liquid-crystalline polymer films; portable equipment; solvent-casting method; superior electrical insulating properties; Circuit stability; Dielectric liquids; Dielectric materials; Dielectrics and electrical insulation; Electronic circuits; Humidity; Liquid crystal polymers; Moisture; Plastic insulation; Polymer films;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location
Shanghai
Print_ISBN
0-7803-9292-2
Electronic_ISBN
0-7803-9293-0
Type
conf
DOI
10.1109/HDP.2005.251410
Filename
4017451
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