Title :
Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading
Author :
Meier, R. ; Kraemer, F. ; Wiese, S. ; Wolter, K.-J. ; Bagdahn, J.
Author_Institution :
Fraunhofer Center for Silicon Photovoltaics CSP, Halle, Germany
Abstract :
Every temperature change induces stress between the module components due to the thermo-mechanical mismatch, which results in a displacement of solar cells in the module and therefore loads the solar cell interconnectors in between. As a result a limiting factor of solar module lifetime is the fatigue behaviour of these electrical cell interconnectors: the copper-ribbons. The purpose of this work is a quantitative estimation of the thermo-mechanical induced strain in the ribbons during service. For this purpose specially prepared solar cells were laminated to a solar module in an industrial process line and filmed during thermal cycling tests. Finally, the loading conditions on the ribbon were assessed by a previously developed lifetime model based on mechanical fatigue testing procedures.
Keywords :
fatigue testing; reliability; solar cells; thermal stress cracking; thermomechanical treatment; copper ribbons; electrical cell interconnector; mechanical fatigue testing; photovoltaic module; solar cell interconnector; thermal cycling test; thermo mechanical induced strain; thermo mechanical loading; Copper; Fatigue; Mathematical model; Photovoltaic cells; Photovoltaic systems; Temperature measurement;
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-5890-5
DOI :
10.1109/PVSC.2010.5614220