Title :
Optical Measurements for Micro- and Opto-electronic Packages/Substrates
Author :
Han, Lei ; Voloshin, Arkady ; Pearson, Ray
Author_Institution :
Central South Univ., Changsha
Abstract :
The optical methods provide noncontact whole-field information with various sensitivities and resolutions. They include moire interferometry, Twyman/Green interferometry, and shadow moire, etc. This is a brief illustrative about our research by using optical methods for microelectronics and optoelectronic packaging. Some practical optical image methodologies for deformation assessment were modified and developed
Keywords :
integrated circuit packaging; integrated circuit testing; integrated optoelectronics; light interferometry; moire fringes; optical variables measurement; electronic substrates; micro-electronic package; noncontact test; optical measurements; opto-electronic package; Cameras; Copper; Electronic packaging thermal management; Gratings; Heat sinks; Optical films; Optical interferometry; Optical sensors; Resistance heating; Surface topography;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
DOI :
10.1109/HDP.2005.251433
