Vacuum Packaging Process Simulation for MEMS Devices

By applying vacuum physics to typical solder reflow vacuum packaging process of MEMS devices, the mathematical and physical model of the vacuum degree change of the cavity to be sealed in related with the gas absorption, desorption, penetration, flowage through little pipe and vapour pressure of materials was established and its arithmetic was ascertained with numerical simulation method. A software module with friendly interface was developed by Visual C++ programming, which comprises results view and parameters input interfaces such as gas parameters input, packaging structure input, reflow time and heating profile input and gas discharging performance input. The veracity of the simulation results was validated by a simulated vacuum packaging experiment, and the effects of the size of capillary pipe and heating profile of solder reflow process on vacuum degree were analyzed based on the simulation results. The parametrical modeling, simulation and optimization design of vacuum packaging process of MEMS devices was realized