DocumentCode
2735314
Title
The ITE safety standard for North America, a development and maintenance process
Author
Ravo, Kevin L.
Author_Institution
Underwriters Labs. Inc., Santa Clara, CA, USA
fYear
1996
fDate
19-23 Aug 1996
Firstpage
518
Lastpage
523
Abstract
This paper is intended to provide a historical perspective of the current bi-national (USA/Canada) standard for information technology equipment (ITE)-UL 1950/CSA 950 third edition (BINAT). Discussed is the development process of the BINAT, leading ultimately to a tri-national standard (USA/Canada/Mexico) or a truly North American standard. Additionally, the maintenance process for the standard is explained, including information regarding how individuals or organizations may influence the content of the standard, (the BINAT or IEC 950). Specifically covered in the paper are: a discussion of the nature of ITE industry including identification of two differing industry perspectives with respect to safety; a brief history of the safety requirements for the ITE industry; a brief overview of the current safety requirements; a discussion of the ongoing maintenance process for the standard; future activities intended to keep the safety requirements relevant and current; and finally, a call to action to continue the development process of safety requirements to keep pace with the evolving industries
Keywords
electromagnetic compatibility; information technology; safety; standards; BINAT; Canada; EMC; IEC 950; ITE industry; ITE safety standard; Mexico; North American standard; UL 1950/CSA 950; USA; binational standard; development process; information technology equipment; maintenance process; organizations; overvoltage testing; safety requirements; trinational standard; Certification; Communication industry; Computer industry; History; IEC standards; Information technology; North America; Product safety; Standards development; Standards organizations;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 1996. Symposium Record. IEEE 1996 International Symposium on
Conference_Location
Santa Clara, CA
Print_ISBN
0-7803-3207-5
Type
conf
DOI
10.1109/ISEMC.1996.561426
Filename
561426
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