Title :
Atomic Diffusion Properties in Al/Ni & Au/Al Bond Interface
Author :
Jun-Hui, Li ; Lei, Han ; Jue, Zhong
Author_Institution :
Mech.-Electronical Eng. Coll., Central South Univ., Changsha
Abstract :
Cross section in bonding point was produced by rubbing and polishing metallographic sample with metallographic inlaying powder. Cross section characteristics on ultrasonic bonded micro-interface (including Au/Al, Al/Ni) were tested by means of scanning electron microscope (JSM-6360LV) and EDS (EDAX2000). Lift-off characteristics at bonding micro-interface of thermosonic bond were observed by using SEM. Results show that atomic diffusion at the bonded interface was occurred each other. Thickness of Au/Al & Al/Ni interface was about 1-3 micron under ultrasonic and thermal energy. Inter-metallic compounds in Au/Al & Al/Ni interface were undiscovered under ultrasonic bonding in very short time that was the order of millisecond. Fracture morphology of lift-off interface was dimpled. Tensile fracture was generated by pull-test not only in bonded interface but also in basis material, and bonded strength at interface was strengthened by diffused atom from another side
Keywords :
aluminium; diffusion bonding; fracture; gold; nickel; scanning electron microscopes; tape automated bonding; ultrasonic bonding; Al-Ni; Al/Ni bond interface; Au-Al; Au/Al bond interface; EDS; SEM; atomic diffusion properties; cross section characteristics; fracture morphology; intermetallic compounds; lift-off characteristics; lift-off interface; metallographic inlaying powder; metallographic sample; scanning electron microscope; tensile fracture; thermal energy; thermosonic bond; ultrasonic bonded microinterface; ultrasonic bonding; ultrasonic energy; Acoustic testing; Aluminum; Bonding forces; Diffusion bonding; Gold; Heating; Inorganic materials; Scanning electron microscopy; Temperature; Wire;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
DOI :
10.1109/HDP.2005.251448