Title :
Slicing floorplans with boundary constraint
Author :
Young, F.Y. ; Wong, D.F.
Author_Institution :
Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
Abstract :
In floorplanning of VLSI design, it is useful if users are allowed to specify some placement constraints in the packing. One particular kind of placement constraints is to pack some modules on one of the four sides: on the left, on the right, at the bottom or at the top of the final floorplan. These are called boundary constraints. In this paper, we enhanced a well-known slicing floorplanner to handle these boundary constraints. Our main contribution is a necessary and sufficient characterization of the Polish expression, a representation of the intermediate solution in a simulated annealing process, so that we can check these constraints efficiently and can fix the expression in case the constraints are violated. We tested our algorithm on some benchmark data and the performance is good
Keywords :
VLSI; circuit layout CAD; integrated circuit layout; simulated annealing; IC layout; Polish expression; VLSI design; boundary constraint; packing; placement constraints; simulated annealing process; slicing floorplanner; Benchmark testing; Circuit simulation; Circuit testing; Costs; Design methodology; Runtime; Shape; Simulated annealing; Very large scale integration;
Conference_Titel :
Design Automation Conference, 1999. Proceedings of the ASP-DAC '99. Asia and South Pacific
Conference_Location :
Wanchai
Print_ISBN :
0-7803-5012-X
DOI :
10.1109/ASPDAC.1999.759699