DocumentCode
2735976
Title
Solder joints reliability of surface mounted components: a requirement for new quality insurance procedures
Author
Auray, M. ; Catherine, P. ; Joly, J.
Author_Institution
BULL, Les Clayes Sous Bois, France
fYear
1988
fDate
13-15 Jun 1988
Firstpage
125
Lastpage
128
Abstract
Thermomechanical simulation of solder joints of J-leaded components has permitted optimizations of the mounting process and provided confidence and time-saving before running qualification tests. The difficulties and the cost of performing solder joint inspection have led to their replacement by novel quality insurance procedures. The first experimental results are promising
Keywords
inspection; printed circuit testing; quality control; reliability; soldering; surface mount technology; J-leaded components; QC; SMT; cost; inspection; qualification tests; quality insurance; reliability; solder joints; surface mounted components; thermomechanical simulation; Capacitive sensors; Inorganic materials; Insurance; Joining materials; Lead; Shape; Soldering; Temperature; Thermal stresses; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location
Neuilly sur Seine
Type
conf
DOI
10.1109/EEMTS.1988.75971
Filename
75971
Link To Document