DocumentCode
2736156
Title
The hierarchical h-adaptive 3-D boundary element computation of VLSI interconnect capacitance
Author
Hou, Jinsong ; Wang, Zeyi ; Hong, Xianlong
Author_Institution
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
fYear
1999
fDate
18-21 Jan 1999
Firstpage
93
Abstract
In deep submicron VLSI circuits, the interconnect parasitic capacitance is a very important factor determining circuit performances such as power and time-delay. The Boundary Element Method (BEM) is an effective tool for solving Laplacian´s equation applied in the parasitic capacitance extraction. In this paper, a hierarchical h-adaptive BEM is presented. It constructs a 3-D linear hierarchical shape function based on a constant boundary element and uses previous computations and solutions. Hence, it reduces computation significantly in the adaptive procedure. Besides, a combination of a residual-type estimator and reduced Z-Z error estimator for more reliable and efficient estimation of error is presented. Some numerical results show that this method is effective
Keywords
VLSI; boundary-elements methods; capacitance; error analysis; integrated circuit interconnections; integrated circuit modelling; 3D linear hierarchical shape function; Laplacian equation; VLSI interconnect capacitance; boundary element computation; error estimation; h-adaptive 3D BEM computation; hierarchical BEM computation; interconnect parasitic capacitance; parasitic capacitance extraction; reduced Z-Z error estimator; residual-type estimator; Boundary conditions; Boundary element methods; Conductors; Integrated circuit interconnections; Interpolation; Laplace equations; Parasitic capacitance; Polynomials; Shape; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 1999. Proceedings of the ASP-DAC '99. Asia and South Pacific
Conference_Location
Wanchai
Print_ISBN
0-7803-5012-X
Type
conf
DOI
10.1109/ASPDAC.1999.759719
Filename
759719
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