• DocumentCode
    2736387
  • Title

    Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium. Proceedings 1988 (IEEE Cat. No. 88CH2629-4)

  • fYear
    1988
  • fDate
    13-15 June 1988
  • Abstract
    Presents the front cover of the proceedings.
  • Keywords
    VLSI; integrated circuit technology; lead bonding; packaging; printed circuit manufacture; surface mount technology; IC technology; PCB manufacture; TAB devices; VLSI; automation; interconnections; multichip modules; packages; reliability; surface mount technologies;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
  • Conference_Location
    Neuilly sur Seine, France
  • Type

    conf

  • DOI
    10.1109/EEMTS.1988.75973
  • Filename
    75973
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2736387