Title :
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium. Proceedings 1988 (IEEE Cat. No. 88CH2629-4)
Abstract :
Presents the front cover of the proceedings.
Keywords :
VLSI; integrated circuit technology; lead bonding; packaging; printed circuit manufacture; surface mount technology; IC technology; PCB manufacture; TAB devices; VLSI; automation; interconnections; multichip modules; packages; reliability; surface mount technologies;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location :
Neuilly sur Seine, France
DOI :
10.1109/EEMTS.1988.75973
