DocumentCode
2736933
Title
Capacitive leadframe testing
Author
Turner, Ted T.
Author_Institution
Hewlett-Packard Co., USA
fYear
1997
fDate
1-6 Nov 1997
Firstpage
124
Abstract
Reliable pin-level diagnosis of open solder joints allows manufacturers to tune SMT process for maximum output. Repair time and repair-induced damage are both significantly reduced with pin-level diagnostics. Detection of misoriented capacitors prevents expensive and reputation-damaging field failures. Ability to test both sides of PCBs allows maximum fault coverage
Keywords
fault diagnosis; printed circuit testing; soldering; surface mount technology; ASIC; PCB two sided testing; Repair time; SMT; capacitive leadframe testing; damage; field failures; fixturing; misoriented capacitors; open solder joints; pin-level diagnosis; pin-level diagnostics; throughput; Capacitors; Circuit faults; Circuit testing; Connectors; Fixtures; Lead; Manufacturing; Soldering; Surface-mount technology; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1997. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-4209-7
Type
conf
DOI
10.1109/TEST.1997.639603
Filename
639603
Link To Document