Title :
Capacitive leadframe testing
Author_Institution :
Hewlett-Packard Co., USA
Abstract :
Reliable pin-level diagnosis of open solder joints allows manufacturers to tune SMT process for maximum output. Repair time and repair-induced damage are both significantly reduced with pin-level diagnostics. Detection of misoriented capacitors prevents expensive and reputation-damaging field failures. Ability to test both sides of PCBs allows maximum fault coverage
Keywords :
fault diagnosis; printed circuit testing; soldering; surface mount technology; ASIC; PCB two sided testing; Repair time; SMT; capacitive leadframe testing; damage; field failures; fixturing; misoriented capacitors; open solder joints; pin-level diagnosis; pin-level diagnostics; throughput; Capacitors; Circuit faults; Circuit testing; Connectors; Fixtures; Lead; Manufacturing; Soldering; Surface-mount technology; Switches;
Conference_Titel :
Test Conference, 1997. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-4209-7
DOI :
10.1109/TEST.1997.639603
