Title :
A Complete Dual-band Chip-set with USB 2.0 Interface for IEEE 802.11 a/b/g WLAN applications
Author :
Fong, Keng ; Tung, David ; Lee, Max ; Lee, Sheng ; Wu, Bart ; Cheng, Paul ; Pare, Tom ; Feng, Julia ; Chang, Julian ; Simpson, Eli ; Wong, John ; Jann, Fred ; Liao, Kevin ; Lo, Dennis
Author_Institution :
Ralink Technol., Hsinchu
Abstract :
A dual-band (2.5 GHz and 5.5 GHz) wireless-LAN chip-set, consists of a RF IC and a BBP/MAC IC with integrated USB 2.0 interface, is presented. Together with external power amplifiers, this chip-set provides the complete solution and meets the IEEE 802.11a/b/g standard specifications. Without using external SAW filters, the system achieves receive sensitivity (54Mbps) of -70 dBm at antenna port, and transmit OFDM error-vector-magnitude better than -28 dB. The active die area of the RF IC and the BBP/MAC IC is 5.4 mm2 and 17 mm2 respectively. The complete solution uses few external components and occupies active board area of less than 1100 mm2
Keywords :
OFDM modulation; UHF integrated circuits; microwave integrated circuits; wireless LAN; 2.5 GHz; 5.5 GHz; BBP IC; IEEE 802.11 a/b/g; MAC IC; RFIC; dual-band chip-set; external power amplifiers; integrated USB 2.0 interface; wireless LAN chip; Dual band; Power amplifiers; Radio frequency; Radiofrequency amplifiers; Radiofrequency integrated circuits; Receiving antennas; SAW filters; Transmitting antennas; Universal Serial Bus; Wireless LAN;
Conference_Titel :
Asian Solid-State Circuits Conference, 2005
Conference_Location :
Hsinchu
Print_ISBN :
0-7803-9162-4
Electronic_ISBN :
0-7803-9163-2
DOI :
10.1109/ASSCC.2005.251714