Electrical characterization of a 25 Gbit/s VCSEL module with TO-46 form factor packaging

Author

Shih, Tien-Tsorng ; Tseng, Pei-Hao ; Jou, Jau-Ji ; Chu, Shun-Shien ; Wu, Yaw-Dong ; Cheng, Wood-Hi

Author_Institution

Dept. of Electron. Eng., Nat. Kaohsiung Univ. of Appl. Sci., Kaohsiung, Taiwan

fYear

2012

fDate

20-22 June 2012

Firstpage

1

Lastpage

4

Abstract

A cost-effective differential-mode packaging of the TO-46 VCSEL module is proposed. The optimal bonding-wire and package solution have been demonstrated through frequency-domain and time-domain simulations. The differential-mode modulation bandwidth of the VCSEL module of above 21 GHz is achieved and a clearly opening eye diagram of 25 Gbit/s is observed. The electrical characterization of the VCSEL module under different driven source impedances is simulated and discussed.

Keywords

electronics packaging; frequency-domain analysis; laser cavity resonators; laser modes; optical modulation; semiconductor lasers; surface emitting lasers; time-domain analysis; TO-46 form factor packaging; VCSEL module; bit rate 25 Gbit/s; cost-effective differential-mode packaging; differential-mode modulation bandwidth; electrical characterization; frequency-domain simulations; opening eye diagram; optimal bonding-wire; source impedances; time-domain simulations; Bandwidth; Equivalent circuits; Impedance; Integrated circuit modeling; Microstrip; Packaging; Vertical cavity surface emitting lasers; 100GbEthernet; Fiber channel (20GFC); TO-46 laser module packaging; VCSEL;

fLanguage

English

Publisher

ieee

Conference_Titel

Networks and Optical Communications (NOC), 2012 17th European Conference on

Conference_Location

Vilanova i la Geltru

Print_ISBN

978-1-4673-0949-3

Electronic_ISBN

978-1-4673-0950-9

Type

conf

DOI

10.1109/NOC.2012.6249929

Filename

6249929