DocumentCode :
2738598
Title :
[Commentary]
fYear :
2008
fDate :
22-24 Oct. 2008
Firstpage :
3
Lastpage :
6
Abstract :
Presents the introductory welcome message from the conference proceedings. May include the conference officers´ congratulations to all involved with the conference event and publication of the proceedings record.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Type :
conf
DOI :
10.1109/IMPACT.2008.4783796
Filename :
4783796
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2738598
