Design and Characterization of Carbon Nanofibers for Via Applications

Author

Wu, Wen ; Nguyen, Dinh ; Wilhite, Patrick ; Saito, Tsutomu ; Krishnan, Shoba ; Yang, Cary Y.

Author_Institution

Center for Nanostruct., Santa Clara Univ., Santa Clara, CA

fYear

2008

fDate

18-21 Aug. 2008

Firstpage

300

Lastpage

301

Abstract

This paper presents results for structural characterization of carbon nanofibers (CNFs) for interconnect via applications. Vertically aligned CNFs were grown in a plasma-enhanced chemical vapor deposition (PECVD) system. We characterized the surface topographies of CNF via structures using atomic force microscopy (AFM). We also demonstrated the capability of capturing one single CNF using the AFM current-sensing technique. Moreover, the correlation between the CNF density and via resistances was analyzed theoretically.

Keywords

atomic force microscopy; carbon nanotubes; integrated circuit interconnections; nanostructured materials; plasma CVD; surface topography; AFM current-sensing technique; C; CNF density; atomic force microscopy; carbon nanofibers; interconnect; plasma-enhanced chemical vapor deposition; structural characterization; surface topography; Atomic force microscopy; Electrodes; Filling; Nanostructures; Nickel; Plasma temperature; Probes; Scanning electron microscopy; Silicon; Surface topography;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanotechnology, 2008. NANO '08. 8th IEEE Conference on

Conference_Location

Arlington, TX

Print_ISBN

978-1-4244-2103-9

Electronic_ISBN

978-1-4244-2104-6

Type

conf

DOI

10.1109/NANO.2008.95

Filename

4617077