Abstract :
The following topics are dealt with: advanced packaging; ASE industry technologies including solder joints, substrate pad metallization and finish, drop impact reliability and failure mechanism, reflow process, mechanical properties of intermetallic compounds, BGA design, and wafer level test; HDI and embedded technology including flexible electronics circuits and modules, Via2-laser embedded technology, microvia filling, and plating; green packaging including wave soldering, lead-free array package reworking; ball grid array packages, halogen-free solder paste, and lead-free soldering; advanced micro-system such as MEMS-based devices; Nan Ya PCB and CCL industrial technologies including wire bonding; flip chip CSP substrate, chip scale packages, and materials for packaging; quality and reliability of solder interconnects, TFBGA package, package on package, panel base package (PBTM); bending and fatigue life tests; green PCB, PCBA, materials, and assembly; DuPont electronics technology including PWB, wafer level packaging, and materials for TSV process; SPIL industry; modeling and simulation of materials and structures for flip chip packaging, wire bonding, and bump design; ITRI 3D technology including 3D interconnection technology, 3D stacked die packages, and system in package; and PTH and metal finishing including plating and dry films.
Keywords :
ball grid arrays; chip scale packaging; electroplating; environmental factors; fatigue testing; impact (mechanical); integrated circuit bonding; integrated circuit design; integrated circuit interconnections; integrated circuit manufacture; integrated circuit metallisation; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; lead bonding; materials testing; micromechanical devices; printed circuit manufacture; printed circuits; reflow soldering; semiconductor process modelling; solders; substrates; surface finishing; system-in-package; system-on-package; wafer level packaging; wafer-scale integration; wave soldering; 3D interconnection technology; 3D stacked die packages; ASE industry technologies; BGA design; HDI technology; ITRI 3D technology; MEMS-based devices; Nan Ya CCL industrial technologies; Nan Ya PCB industrial technologies; PBTM; PTH; SPIL industry; TFBGA package; TSV process; Via2-laser embedded technology; advanced microsystem; advanced packaging; ball grid array packages; bending test; chip scale packages; drop impact reliability; dry films; failure mechanism; fatigue life tests; flexible electronic modules; flexible electronics circuits; flip chip CSP substrate; green PCB; green PCBA; green assembly; green packaging; halogen-free solder paste; intermetallic compounds; lead-free array package reworking; lead-free soldering; mechanical properties; metal finishing; microvia filling; package on package; packaging materials; panel base package; plating; reflow process; solder interconnect reliability; solder joints; substrate pad finish; substrate pad metallization; system in package; through silicon via process; wafer level test; wave soldering; wire bonding;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
