Development of Low-Loss Millimeter-Wave Antennas Using Electro-Fine-Forming Fabrication

Author

Ito, N. ; Mase, A. ; Kogi, Y. ; Seko, N. ; Tamada, M. ; Sakata, E.

Author_Institution

Kyushu Univ., Fukuoka

fYear

2006

fDate

18-22 Sept. 2006

Firstpage

268

Lastpage

268

Abstract

The development of high performance millimeter-wave planar antennas using low-loss fluorine substrate is reported. The problems to be solved are low degree of adhesion between copper foil and fluorine substrate and shape of antenna pattern. In order to solve the problems, surface treatment of fluorine substrate and a fabrication method using electro fine forming (EF2) are described.

Keywords

adhesion; copper; electroforming; fluorine; foils; millimetre wave antennas; planar antennas; surface treatment; Cu; F; adhesion; antenna pattern; copper foil; electro-fine-forming fabrication; fluorine resin; fluorine substrate; low-loss millimeter-wave antennas; micro fabrication technology; millimeter-wave planar antennas; surface treatment; Adhesives; Dielectric constant; Dielectric substrates; Fabrication; Millimeter wave technology; Planar arrays; Polymer films; Resins; Surface treatment; Transmission line antennas;

fLanguage

English

Publisher

ieee

Conference_Titel

Infrared Millimeter Waves and 14th International Conference on Teraherz Electronics, 2006. IRMMW-THz 2006. Joint 31st International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0400-2

Electronic_ISBN

1-4244-0400-2

Type

conf

DOI

10.1109/ICIMW.2006.368476

Filename

4222210