• DocumentCode
    2738733
  • Title

    Terahertz Integrated Transmission Line Sensors Using a Bonded Epitaxial GaAs Layer on Silicon Substrates

  • Author

    Ouchi, T. ; Kasai, S. ; Kurosaka, R. ; Itsuji, T. ; Yoneyama, H. ; Yamashita, M. ; Kawase, K. ; Ito, H.

  • Author_Institution
    Canon Inc., Tokyo
  • fYear
    2006
  • fDate
    18-22 Sept. 2006
  • Firstpage
    273
  • Lastpage
    273
  • Abstract
    We have developed a novel process of transmission line type terahertz (THz) devices for biological sensing. A low-temperature-grown (LT) GaAs layer side is bonded onto silicon substrates using Au-Sn solder, then the GaAs substrate is removed by selective wet etching. Photoconduetive switch elements for generating and detecting THz signals are fabricated on the transferred LT-GaAs layer. This process results in robust integrated devices against biological solutions. Sequential measurement of THz time domain spectroscopy is available for biological molecules such as DNA samples. We observe clear difference in delay time shifts according to change of quantity and the state of applied molecules.
  • Keywords
    DNA; III-V semiconductors; biosensors; gallium arsenide; submillimetre wave detectors; transmission lines; AuSn; DNA samples; GaAs; THz time domain spectroscopy; biological molecules; biological sensing; bonded epitaxial layer; photoconduetive switch elements; selective wet etching; sequential measurement; silicon substrates; solder; terahertz devices; terahertz integrated sensors; transmission line sensors; Biosensors; Bonding; Gallium arsenide; Signal detection; Signal generators; Silicon; Substrates; Switches; Transmission lines; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Infrared Millimeter Waves and 14th International Conference on Teraherz Electronics, 2006. IRMMW-THz 2006. Joint 31st International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0400-2
  • Electronic_ISBN
    1-4244-0400-2
  • Type

    conf

  • DOI
    10.1109/ICIMW.2006.368481
  • Filename
    4222215