DocumentCode
2739178
Title
Peek for Lead-Free Soldering Processes and Electronics Applications
Author
Chen, Jeff
Author_Institution
Hillhouse Int., Victrex plc, Thornton-Cleveleys
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
131
Lastpage
136
Abstract
The electronics industry is moving from lead-based solder systems to lead-free solder systems. This change increases the processing temperatures used to melt and flow the new lead-free solders. This is causing many of the traditional polymeric materials used for electronic components to fail. Therefore, the polymers with high temperature resistance, such as VICTREXreg PEEK (poly (aryl ether ether ketone)) polymer, are getting very important in the manufacturing processes using lead-free solders. In this paper, the performance of PEEK polymer and other plastic materials are presented from a lead-free soldering process viewpoint. This paper also describes some applications in which PEEK polymer has been successfully applied, including mobile phone secondary battery gaskets, speaker diaphragms, connectors, and so on.
Keywords
plastics; polymers; soldering; tensile strength; thermal conductivity; VICTREX PEEK; connector application; high temperature resistance polymer; mobile phone secondary battery gasket; plastic materials; poly(aryl ether ether ketone) polymer; soldering process; speaker diaphragm; tensile strength; Electronic components; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Manufacturing processes; Mobile handsets; Plastics; Polymers; Soldering; Temperature; PEEK; lead-free solders; plastics; poly (aryl ether ether ketone);
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location
Taipei
Print_ISBN
978-1-4244-3623-1
Electronic_ISBN
978-1-4244-3624-8
Type
conf
DOI
10.1109/IMPACT.2008.4783825
Filename
4783825
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