• DocumentCode
    2739178
  • Title

    Peek for Lead-Free Soldering Processes and Electronics Applications

  • Author

    Chen, Jeff

  • Author_Institution
    Hillhouse Int., Victrex plc, Thornton-Cleveleys
  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    131
  • Lastpage
    136
  • Abstract
    The electronics industry is moving from lead-based solder systems to lead-free solder systems. This change increases the processing temperatures used to melt and flow the new lead-free solders. This is causing many of the traditional polymeric materials used for electronic components to fail. Therefore, the polymers with high temperature resistance, such as VICTREXreg PEEK (poly (aryl ether ether ketone)) polymer, are getting very important in the manufacturing processes using lead-free solders. In this paper, the performance of PEEK polymer and other plastic materials are presented from a lead-free soldering process viewpoint. This paper also describes some applications in which PEEK polymer has been successfully applied, including mobile phone secondary battery gaskets, speaker diaphragms, connectors, and so on.
  • Keywords
    plastics; polymers; soldering; tensile strength; thermal conductivity; VICTREX PEEK; connector application; high temperature resistance polymer; mobile phone secondary battery gasket; plastic materials; poly(aryl ether ether ketone) polymer; soldering process; speaker diaphragm; tensile strength; Electronic components; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Manufacturing processes; Mobile handsets; Plastics; Polymers; Soldering; Temperature; PEEK; lead-free solders; plastics; poly (aryl ether ether ketone);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3623-1
  • Electronic_ISBN
    978-1-4244-3624-8
  • Type

    conf

  • DOI
    10.1109/IMPACT.2008.4783825
  • Filename
    4783825